Shanghai Huaqing Solder M&T Co., Ltd. originated from Shanghai Huahai Solder Material Technology Research Institute. Founded in 1999 in Songjiang, Shanghai, we have over 20 years of experience in semiconductor packaging soldering materials.
A pioneer in domestic lead-free solder and solder preform R&D, we have achieved core technical breakthroughs for high-end semiconductor soldering material localization.
We develop, produce and sell solder paste, solder preforms, flux, die-bonding solder wires, solder bars and thermal conductive materials for semiconductor, automotive electronics, military, photovoltaic and consumer electronics sectors.
As a National High-Tech Enterprise and Shanghai SRDI SME, we operate in-house R&D labs, hold 16 authorized patents, ISO 9001 & IATF 16949 certifications, and are a member of the SMT Professional Committee of Shanghai Electronic Manufacturing Industry Association.
**Technology‑driven Foundation, Innovation for Long‑term Growth**
Rooted in lead-free and electronic packaging expertise, we focus on core R&D to advance high-end solder material localization and support the independent, controllable development of China’s electronics supply chain.
**Customer‑Centered, Value Created Jointly**
We solve customers’ soldering challenges with professional technologies and premium materials. Offering one-stop support from material selection to process deployment, we co-develop solutions with clients to set industry benchmarks.
**Smart Green Manufacturing for Sustainability**
Committed to lead-free soldering, we operate eco-friendly production lines. Through green manufacturing, we drive low-carbon transformation in electronics and protect the industrial ecosystem.
Corporate Values
Development・Innovation
Work Philosophy
Cooperation・Professionalism・Persistence・Integrity
Quality Culture
Strive to get it right the first time. Responsibility・Honor・Quality
Safety Culture
What you spot is your responsibility. Responsibility・Honor・Safety
Served as a visiting scholar at Tokyo Institute of Metallic Materials Technology, Japan
Graduated from Nanjing University in 1962, majoring in Metal Physics.
Senior Engineer, Senior Member of the Chinese Institute of Electronics, Member of the SMT Consulting Expert Committee, and Leader of the Shanghai Electronic Manufacturing Lead-Free Working Group.
Founded Shanghai Huaqing Solder Material Technology Co., Ltd. in 1999.
Original Aspiration To fill the market gap of domestic soldering materials at that time.
Entrepreneurial Tenet Technology as the foundation, craftsmanship as the soul.
*Latest Advances in Soldering Technology*
*Effects of Trace Elements on Wettability of Tin‑Lead Solders*
*Mechanism of SMT Soldering*
*Second‑Generation Cost‑Effective Lead‑Free Solder Paste*
*Lead‑Free Soldering Technology and Its Challenges*
*Intermetallic Compounds at Soldering Interfaces*
Eco‑Friendly & Lead‑Free
Complete Product Portfolio
Consistent Quality
Rapid Sampling Service