When defects such as BGA cold solder joints, component offset, solder‑joint oxidation and device damage occur during production, repairs can be completed through manual desoldering, substrate cleaning and re‑soldering. This reduces scrap of circuit boards and components and effectively controls production costs.

Industry Challenges & Solutions

Circuit‑board repair, desoldering of special‑shaped components and small‑batch supplementary soldering operations are prone to secondary damages such as pad damage, thermal burns to surrounding components and residual solder. Conventional consumables have significant operational limitations.

Huaqing’s special consumables including lightweight rework solder wires and low‑residue rework fluxes are tailored for delicate manual operations. They improve the efficiency of desoldering and supplementary soldering and reduce product loss during repair procedures.