Thermal interface materials are core materials used to fill the micro‑gaps between CPUs/GPUs and heat sinks. They maximize heat‑transfer efficiency to ensure stable operation of core chips under high‑load conditions.

The deployment of dedicated thermal interface materials can significantly reduce contact thermal resistance and improve the overall efficiency of heat‑dissipation systems.

Industry Challenges & Solutions

Conventional thermal interface materials are prone to performance degradation, drying‑out or delamination under high‑temperature and high‑pressure conditions. This gives rise to increased thermal resistance and impairs long‑term chip stability.

Huaqing’s customized high‑performance thermal interface materials feature outstanding thermal conductivity and long‑term stability. They maintain consistent performance under extreme operating conditions, effectively lowering core temperatures of CPUs and GPUs. The materials support uninterrupted year‑round stable operation of servers and deliver greater value for customers.