As the core interconnection structure of SiP (System‑in‑Package) packaging, BGA undertakes electrical conduction and thermal load‑bearing for chips. Matched with dedicated soldering materials, it enables uniform formation of bottom ball‑grid solder joints, balancing packaging compactness and electrical transmission stability.

Industry Challenges & Solutions

With continuously rising integration of SiP devices, BGA balls feature reduced diameter and finer pitch. Conventional soldering materials suffer poor wettability, which easily causes ball cracking, solder joint voids, offset and solder bridging. Excessive thermal stress may further result in package cracking.

Huaqing’s dedicated soldering materials optimized for SiP processes deliver superior wettability. They enable precise formation of miniature BGA solder balls and relieve thermal stress generated during soldering to eliminate defects such as solder bridging and cold solder joints. Balancing thermal dissipation performance and electrical reliability, the materials are compatible with mass‑production reflow soldering processes to improve packaging yield and control chip packaging production costs.