As a core carrier component of TOSA/ROSA, the inner insulation frame provides electrical circuit insulation isolation as well as positioning and protection for electronic components.

Matching dedicated soldering materials enable non‑damaged soldering of dissimilar materials, ensuring the synchronous and stable operation of optical paths and electrical circuits.

Industry Challenges & Solutions

With accelerating miniaturization iteration of optical devices, conventional soldering materials tend to burn out insulation layers under high‑temperature soldering conditions, resulting in defects such as cold solder joints, voids, electric leakage and short‑circuits.

HQ’s customized solder paste and solder wire are engineered for low‑temperature processes. They avoid damage to insulating substrates during soldering and reduce solder joint defects. They deliver robust bonding strength for dissimilar‑material pin soldering, and are compatible with mass‑production processes including reflow soldering and thermal compression bonding. Outstanding reliability is maintained under high‑low temperature cycling conditions, stabilizing production yield while optimizing customers’ manufacturing costs.