Thermal Interface Materials

Ultra‑high Purity for Excellent Thermal Performance

Manufactured from high‑purity metallic indium with purity of 99.99 % or higher and extremely low impurity levels. Delivering superior thermal conductivity, the material quickly conducts heat generated during component operation and effectively reduces thermal resistance. It avoids component ageing and failure induced by heat build‑up, ensuring long‑term stable operation of core assemblies.

Precision Forming with Stringent Dimensional Control

Produced by precision rolling and cutting processes, the foils feature uniform thickness and high dimensional accuracy. Custom ultra‑thin, micro‑size and special‑profile specifications are available. They perfectly fill micro‑gaps within high‑end precision assemblies and conform to component surfaces to guarantee uniform thermal transfer and bonding, suited for fine‑pitch and miniaturized high‑end packaging scenarios.

Excellent Ductility & Broad Soldering Compatibility

Metallic indium exhibits exceptional ductility and plasticity. It accommodates temperature variation and pressure requirements of diverse soldering processes, resisting cracking and delamination during soldering. It forms intimate bonding with various metallic components and supports high‑precision processes such as vacuum reflow soldering and thermo‑compression bonding for robust interconnection reliability.

Broad Temperature & Environmental Resistance for Demanding Service Conditions

Boasting excellent high‑/low‑temperature endurance and corrosion resistance, it operates stably across a wide temperature range from ‑200 ℃ to 150 ℃. Adaptable to harsh service conditions including high temperature, high‑load and humid environments, it meets long‑term reliability requirements for high‑end sectors covering power devices, aerospace electronics and medical equipment.