Overview
Water‑soluble flux is a high‑activity, high‑solid‑content flux system that can be completely cleaned by aqueous rinsing. It features powerful oxide‑removal capability and excellent tinning performance during soldering. Post‑solder residues can be fully eliminated by pure‑water washing, leaving no ionic residues and avoiding potential insulation failures.
Applicable Processes
Compatible with mainstream processes: reflow soldering, wave soldering, soldering of high‑power devices with pre‑formed solders, and mass through‑hole soldering.
Core Advantages
Extra‑high Activity
Delivers full and sufficient tin deposition even on heavily‑oxidized pads, effectively reducing defects such as cold solder joints and missing solder.
Complete Cleaning with Zero Residues
No halogen or ionic contamination remains after water rinsing, eliminating risks of electric leakage and corrosion.
High‑temperature Resistance & Anti‑carbonization
Resists discoloration and carbon accumulation under high soldering temperature and yields high‑gloss solder joints.
Exceptional Reliability
Complies with stringent quality standards for military‑grade, automotive‑grade and industrial‑control applications, making it the preferred option for high‑cleanliness soldering.
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