Low‑residue No‑clean Flux
Low‑residue no‑clean flux is suitable for soldering of discrete power devices, PCB SMT assembly, medium‑and‑small power modules, RF components and general semiconductor packaging.
Overview
Low‑residue no‑clean flux adopts an eco‑friendly low‑solid‑content formulation. Minimal residues remain on solder‑joint surfaces after soldering. Insulation and reliability standards can be satisfied without water‑washing or solvent cleaning.
Applicable Processes
Compatible with common soldering processes including conventional nitrogen‑atmosphere reflow soldering, wave soldering, manual soldering‑iron soldering and reflow after pre‑formed solder foil mounting.
Core Advantages
Low Solid Content
Low solid‑content yields thin, light residues without white discoloration, with no adverse impact on appearance and insulation performance.
Moderate Activity
Stable under ambient‑temperature storage and low corrosion risk to solder pads.
High Material Compatibility
Compatible with multiple soldering materials including lead‑free solder paste and pre‑formed solders, well‑suited for high‑volume SMT production lines.
Streamlined Manufacturing Process
Eliminates cleaning procedures, reduces consumption of cleaning chemicals and wastewater‑treatment costs, balancing production efficiency and environmental‑protection requirements.
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