High‑cleanliness Pre‑formed Solder
Pre‑formed solder is widely adopted for high‑reliability precision semiconductor and new‑energy electronic devices, including SiC/IGBT power modules, discrete power devices, SiP system‑in‑package, optical‑communication optical modules, automotive electronic control units, photovoltaic inverters, RF microwave components and MEMS sensors.
Mainstream Application Processes
Compatible with vacuum formic‑acid reflow soldering, nitrogen‑atmosphere reflow soldering, laser eutectic bonding, vacuum thermo‑compression bonding, large‑area die‑attach bonding on DBC substrates, SMT supplementary tin feeding, hermetic ring soldering for through‑hole components, and hermetic packaging soldering for optical devices. It supports high‑speed precise placement via automatic pick‑and‑place machines, as well as manual alignment for small‑batch prototyping.
Patented Products
A Multi‑element Alloy Lead‑free Solder and Its Preparation Method
Pre‑formed Lead‑free Solder Foil for Reducing Soldering Voids, Its Preparation Method and Application
Core Advantages
High Dimensional Accuracy
Excellent flatness. Custom geometries including squares, rings, washers and micro special‑shaped profiles are available. Extremely tight tolerance on solder volume ensures outstanding consistency in mass soldering.
Comprehensive Alloy Portfolio
Special alloys such as lead‑free tin‑silver‑copper, high‑temperature lead‑bearing, gold‑tin and indium‑based alloys are covered, matching low‑, medium‑ and high‑temperature packaging processes.
Multiple Packaging Options
Tape‑and‑reel, sheet‑form and individual separated‑piece packaging are offered to enable high‑speed picking on automated production lines for greatly improved productivity.
Anti‑oxidation Treatment
In‑house developed anti‑oxidation treatment delivers superior wetting performance with low post‑solder residues. Compatible with both no‑clean and water‑wash cleaning processes, it addresses typical industry pain points such as excessive solder overflow over large‑area power devices.
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