Pre‑coated Solder
Pre‑coated solder is mainly applied to precision semiconductor and new‑energy power‑electronic devices such as IGBT/SiC power modules, discrete power devices, optical‑communication OSA/ROSA assemblies, SiP packages, automotive millimeter‑wave radars, MEMS sensor modules and power substrates for photovoltaic inverters.
Overview
Pre‑coated solder integrates solder material and flux as one unit, eliminating inconsistent dispensing volume and cavity residual contamination caused by separate flux dispensing. Custom dimensions are available according to device cavity sizes. The thin coating does not occupy internal optical‑path or component assembly space. It resists oxidation degradation during storage and transportation, and is well‑suited for small‑gap soldering of miniature precision devices.
Applicable Processes
Vacuum formic‑acid reflow eutectic bonding: large‑area bonding between power chips and DBC ceramic substrates
Nitrogen‑atmosphere reflow soldering: hermetic packaging for optical devices and RF modules
Vacuum thermo‑compression bonding: die‑attach for flip‑chips and discrete MOSFETs
High‑speed mounting via automatic pick‑and‑place machines: standardized operations for mass‑production lines
Laser welding: precision hermetic sealing for micro‑sensors and small‑cavity components
Core Advantages
High Dimensional Precision
Accurately controlled dimension and solder volume prevent solder overflow and insufficient solder.
Simplified Production
Uniform pre‑applied built‑in flux removes paste‑dispensing steps for easier manufacturing.
Robust Coating
Firm flux coating with no powder shedding. Delivers good soldering wettability and low void rate, suitable for high‑reliability automotive‑grade applications.
Diverse Alloy Portfolio
Wide range of alloy options available. Tape‑and‑reel automated packaging is supported to improve throughput and reduce costs in mass‑production.
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