Excellent Molten Fluidity

Well‑proven alloy formulation delivers bright and even molten‑tin surface with uniform tin deposition. Fast wetting is achieved even for large pads and bulky metallic components.

Anti‑oxidation & Reduced Dross for Lower Maintenance

Special anti‑oxidant elements are incorporated. Low dross build‑up during extended high‑temperature holding inside solder pots reduces solder consumption and furnace‑cleaning frequency.

Stable Solder‑joint Mechanical Strength

Solder joints possess good ductility with high vibration resistance and thermal‑shock resistance, satisfying long‑term service requirements for household appliances and low‑end industrial‑control equipment.

Outstanding Cost‑performance & Easy Handling

Broad melting‑temperature tolerance with low equipment requirements and low barriers for storage and melting processes. Ideal for mass‑production of cost‑effective electronic products.