TIM1/1.5
TIM1 and TIM1.5 are core thermal‑interface materials for high‑end semiconductors, manufactured from pre‑formed foils of high‑purity indium and tin‑based alloys.
Overview
Pure indium foils are high‑ductility metal‑based Grade‑1 TIM materials. Different from polymer‑based materials such as thermal greases and phase‑change pads, they deliver intrinsic metallic thermal conduction with zero outgassing and no drying‑out. Specially engineered for ultra‑low‑thermal‑resistance heat dissipation of the TIM1 layer in semiconductor packaging, they conform to micro‑uneven surfaces of chips to achieve supreme thermal conduction at the chip interface.
Applicable Processes
Vacuum eutectic bonding, thermo‑compression lamination.
Core Advantages
Comprehensive Specification Coverage
Multiple alloy systems are available from stock with full ranges of thickness, length and width. Standard square / rectangular foils are ready‑to‑use for direct machine mounting.
Custom Machining Capability
Custom services for ultra‑thin, large‑size and special‑shape foils are supported with micron‑level tolerance control.
Long‑lasting & Stable Performance
Free of silicone oil outgassing, drying‑out or pump‑out effects. Resistant to high‑low‑temperature cycling; thermal performance exhibits no degradation under long‑term high‑load operation.
Non‑corrosive for Precision Packaging
Chemically inert, non‑corrosive to chips and heat spreader lids, with zero organic residues. Compliant with high‑cleanliness manufacturing standards for semiconductors and optical‑communication applications.
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