High‑lead Solder Wire
High‑lead solder wire is mainly used for die‑attach fixation, lead soldering and low‑temperature thermal‑shock‑resistant packaging of resonator devices such as crystal oscillators, quartz crystals and piezoelectric wafers.
Overview
High‑lead solder wire is manufactured from high‑lead low‑tin alloy formulation. It features high melting point and exceptional creep resistance, with high‑quality embedded flux core. Specially developed for die‑attach, crystal bonding and reinforcement soldering of crystal components, it is a proven dedicated soldering consumable for the crystal‑oscillator industry.
Applicable Processes
Die‑attach soldering for quartz crystals, crystal‑oscillator lead fixation, packaging soldering for piezoelectric components, spot‑welding reinforcement for micro‑wafers, touch‑up soldering for high‑temperature‑resistant components.
Core Advantages
High‑temperature Creep Resistance for Robust Fixation
Resists softening and deformation under high‑temperature conditions, effectively preventing displacement and detachment of crystals. It delivers superior fastening performance compared with conventional lead‑bearing solder wire.
Matched Thermal‑expansion Coefficient to Prevent Wafer Cracking
Low thermal‑shrinkage stress avoids wafer cracking during thermal cycling and improves production yield.
Long‑term Stable Performance without Degradation
Excellent wetting and bonding performance for wafers and metal frames. Solder joints are robust with strong vibration resistance.
Non‑corrosive for Precision‑grade Packaging
Higher melting point ensures solder joints will not remelt or separate during secondary baking and curing processes, fully compatible with complete crystal production lines.
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