Ultra-Fine Printing

Supports 01005 components and 0.3mm-pitch BGA. Ultra-fine spherical T4-T8 powder ensures zero-bridging release, ideal for high-density advanced packaging.

Ultra-Low Voiding

Proprietary halogen-free flux keeps post-solder voiding below 5%, greatly improving heat dissipation and long-term electrical reliability.

Wide Process Window

Wide 220-260℃ reflow window with 2-3x reworkability, compatible with QFN, Flip Chip and SiP system-in-package processes.

Superior Reliability

High-purity alloy resists thermal fatigue and electromigration; high SIR residue passes stringent temp/humidity tests for automotive and power modules.