Suitable for manual and automated dispensing production lines.

LF‑200 features favourable rheological behaviour and stable viscosity. No stringing, tailing or slumping occurs during continuous production, delivering consistent and controllable dispensed volume. It provides a wide reflow process window compatible with various thermal profiles. Even for high‑heat‑absorption components, which often require extended reflow time to reach target temperature, LF‑200 maintains stable activity and sound soldering performance.

Despite its high soldering activity, residues of LF‑200 are safe and stable, non‑corrosive, colourless and transparent, requiring no post‑reflow cleaning.

Core Advantages

• Compliant with IPC ROL0 no‑clean specifications

• Good fluidity and viscosity stability for consistent dispensing performance

• Excellent wettability for hard‑to‑solder metals such as nickel and palladium

• Low void rate and high joint strength

• Wide reflow window, compatible with multiple thermal profiles

• Halogen‑free compliance

• Highly stable residues: non‑corrosive, colourless and transparent