Specially designed for high‑precision surface‑mount applications.

LF‑217P delivers good soldering activity and produces bright, full solder joints. It achieves excellent soldering performance for components such as QFP, SOIC, TSSOP and BGA.

Product Features

• Halogen‑free; flux meets IPC ROL0 requirements

• Good print fluidity and viscosity stability for consistent printing performance

• Excellent fine‑feature printing capability

• Superior wettability across a broad reflow window; suitable for hard‑to‑solder metals such as nickel and palladium

• Eliminates Head‑in‑Pillow defects for BGA assemblies