Engineered for high‑precision printing and reflow, compatible with lead‑free alloys such as SnAgCu and SnAg.

LF‑221P delivers excellent wettability on various common soldering interfaces including OSP Cu, ENIG, HASL Sn and Ag. In addition, LF‑221P features superior resistance to Head‑in‑Pillow (HIP) defects and low‑void performance, ensuring high soldering yield and reliability.

Core Advantages

• Compliant with IPC ROL0 no‑clean specifications

• Wide reflow window under air and nitrogen, compatible with multiple thermal profiles; ensures consistent soldering quality across board areas with different heat‑absorption characteristics

• Good fluidity and viscosity stability for reliable printing consistency

• Outstanding wettability on both fresh and aged soldering surfaces

• Minimal bridging, tombstoning and solder‑ball formation

• Colourless transparent post‑reflow residues with excellent probe‑testability

• Suitable for air or nitrogen reflow