TQ01-SBA is formulated by mixing low-oxidation tin powder and high-efficiency flux under vacuum conditions. During reflow soldering, the flux rapidly activates. Once the solder melts, it delivers excellent fluidity and superior wettability. This solder paste is designed for medium- and low-temperature soldering applications such as thermal modules and LEDs.

TQ01-SBA is completely halogen-free. While halogens are eliminated from its formulation, the innovative formula achieves outstanding soldering performance. It exhibits exceptional wettability on OSP copper, HASL tin plating, silver-plated and nickel pads. After reflow, solder joints are bright and full with no darkening. Residues are colourless, transparent and non-corrosive, offering top-tier safety performance in the industry.

TQ01-SBA features a wide reflow window, compatible with various reflow profiles. It ensures consistent, high-quality solder joints across components with varying heat absorption characteristics.

Core Advantages

• Halogen-free 

• Excellent wettability, suitable for hard-to-solder metals including nickel and palladium 

• Stable viscosity and good printability 

• Bright, full solder joints free of darkening and solder balls 

• High reliability; minimal rosin residues, colourless, transparent and non-corrosive 

• Supports reflow soldering in both air and nitrogen atmospheres

Alloy & Reflow