Delivers substantial improvements over legacy products in residue cleanability and component‑shift suppression.

Under high‑temperature vacuum conditions, flux inside conventional solder pastes tends to carbonize rapidly.

 Forced outgassing also aggravates flux spattering, leaving tenacious residues that are difficult to remove completely. Benefiting from its unique flux system, CS902‑D2 enables thorough residue cleaning even after high‑temperature vacuum soldering at 410 °C. It also minimizes spattering and significantly improves yield for downstream wire‑bonding and mould‑encapsulation processes.

Core Advantages

• Good wettability on metallized surfaces including Ag, Cu, Ni, Au, etc.

• Easily cleanable residues

• Low void rate

• Suppresses component shifting and improves solder‑layer thickness uniformity

• Halogen‑free

• Minimal spattering; no chip discoloration

• Compatible with nitrogen or vacuum reflow