The specially designed activation system enables CS911 to maintain soldering activity without discoloring or corroding chips and other components, while minimizing flux spattering.

With proper soldering processes, CS911 achieves an ultra-low void rate. For small and medium-sized chips (<10×10 mm), the void rate can be kept below 5%. When a secondary vacuum process is adopted, the void rate can be further reduced to less than 1%.

Residues of CS911 are highly cleanable. Common solvent cleaners such as hydrocarbon and haloalkane cleaners can completely remove residues, ensuring high yields for subsequent processes including wire bonding and encapsulation.

Core Advantages

• Excellent wettability on silver, copper, nickel and gold interfaces 

• Low void rate 

• Easily cleanable residues

• No solder balls on chip sidewalls 

• Stable performance for printing and dispensing 

• Minimal spattering and discoloration 

• Compatible with nitrogen or vacuum reflow