Its high activity effectively reduces soldering voids and improves joint quality.

High tackiness and excellent tack durability perfectly meet the requirements of high‑speed assembly processes. Stable long‑term printability is guaranteed even for ultra‑fine‑pitch applications. It delivers outstanding wetting performance on metallized substrates such as OSP, Au/Ni and HASL, and features a broad process window. It is fully compatible with standard eutectic SnPb, SnPbAg and SnAgCu alloys, delivering reliable performance for diverse packaging applications.

Product Features

• Broad reflow process window

• Consistent fine‑pitch printed deposit

• Extended working‑life performance

• Excellent tack strength

• Well‑suited for high‑speed assembly processes

• Excellent wettability under both air and nitrogen reflow conditions