CS951 is a distinctive low-residue high-temperature die attach solder paste. After soldering, its residue accounts for only 0.4% of the total solder paste weight (or 4% of the flux weight). By comparison, conventional die attach solder pastes generate residues equivalent to 30–50% of the flux weight. Thanks to its ultra-low residue characteristic, CS951 enables true no-clean application for certain packaging products.

While delivering ultra-low residue, CS951 maintains excellent soldering performance with minimal voids and outstanding wetting on a wide range of metallic interfaces. Furthermore, CS951 residues exhibit good compatibility with epoxy molding compounds. No delamination occurs between substrate and residue, or between residue and molding compound.

Core Advantages

• Ultra-low residue 

• Ultra-low void 

• Excellent wettability on silver, copper, nickel and gold interfaces 

• Halogen-free 

• Wide process window, compatible with various profiles

• No delamination with epoxy molding compounds 

• Non-corrosive and non-discoloring