VR11-SS5 features moderate activity, easily cleanable post-soldering residues and non-discoloration of components, making it highly suitable for semiconductor packaging. It is especially ideal for bonding between large-size chips, DBC and heat sinks in power devices such as IGBTs. Products packaged with VR11-SS5 can achieve a void rate below 1%, delivering uniform and flat solder interfaces with minimal spattering and solder balls.

Residues left after VR11-SS5 reflow can be readily removed with common solvent cleaners including hydrocarbons, halocarbons, or water-based cleaners. After cleaning, no discoloration, corrosion or water-like stains remain on chips, DBCs and heat sinks.

The unique formulation of VR11-SS5 effectively suppresses chip or DBC shifting. Even on heat sinks with a large pre-bend curvature, DBC displacement can be prevented to boost soldering yield.

Core Advantages

• Activity grade ROL0 

• Low soldering void rate (<1%) 

• Outstanding performance in inhibiting chip shifting 

• Wide process window, compatible with various heating profiles 

• Compatible with all common metallic interfaces: copper, nickel, silver and gold 

• Minimal spattering and solder balls 

• Easily cleanable residues 

• No discoloration on chips, circuits or substrates