CS751C is a rosin‑based, high‑activity lead‑free solder paste specially formulated for die‑attach applications, compatible with both air and nitrogen reflow environments.

It effectively reduces soldering voids and enhances joint reliability. Its high tackiness and excellent tack durability are well‑suited for die‑attach process requirements. Superior viscosity stability ensures consistent continuous dispensing performance. CS751C delivers excellent wetting performance on common metallized surfaces including OSP, Au/Ni, Cu and Ag, and features a broad reflow process window, providing reliable performance for diverse electronic‑assembly scenarios.

Residues from CS751C can be thoroughly removed by commercially‑available solvent‑based cleaners without any adverse impact on wire‑bonding (WB) and mould‑encapsulation processes.

Product Features

• High activity, suitable for all common metallized surfaces

• Low void performance

• Stable dispensing and printing performance

• Outstanding tack strength

• Easily removable residues

• Excellent wettability under both air and nitrogen reflow conditions