Solder Foils

IGBT Module, Low Void & High Reliability
Low Oxygen Content, High Cleanliness & High Purity

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Huaqing is one of China’s earliest professional suppliers for mass-produced high-cleanliness solder preforms for IGBT modules. Through collaboration with leading industry customers, our products have been used to package more than 100,000,000 IGBT modules. These high-performance modules serve diverse sectors including electric vehicles, photovoltaics, rail transit, power grids and consumer electronics. Huaqing can provide solder preforms in various specifications, alloys and packaging options to meet different soldering requirements.


We are also eager to jointly research and develop specialty alloys and applications with customers, and deliver corresponding samples rapidly.



Performance Features

• Ultra-low impurity content 

• Uniform and precise composition 

• Low oxygen content, minimal soldering voids 

• Excellent surface quality 

• High dimensional accuracy, burr-free



Dimensional Tolerance



Packaging & Storage

Multiple packaging options are available upon customer request, including plastic boxes, carrier tapes, trays and reels. The shelf life is 6 months for unopened packages. After opening, storage in a nitrogen cabinet is recommended. If nitrogen storage is unavailable, seal the product with desiccants. Keep away from high-temperature heat sources, direct sunlight, acids, alkalis and moisture.


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