Pure indium foils are high‑ductility metal‑based Grade‑1 TIM materials. Unlike polymer‑based materials such as thermal greases and phase‑change pads, they provide intrinsic metallic thermal conduction with zero outgassing and no drying‑out. Specially engineered for ultra‑low‑thermal‑resistance heat dissipation of the TIM1 layer in semiconductor packaging, they conform to micro‑uneven surfaces of chips to achieve supreme thermal conduction at the chip interface.

Compatible with vacuum eutectic bonding and thermo‑compression lamination processes. Applied for TIM1 / TIM1.5 thermal bonding of AI‑computing GPUs, CPUs and high‑speed optical modules. It fully fills gaps and greatly reduces interfacial thermal resistance.

Core Advantages

• Standard‑thickness indium foils available from stock with abundant flat full‑sheet options, suitable for diverse chip thermal‑bonding working conditions

• Custom cutting for ultra‑thin, large‑size and special‑shape indium foils with micron‑level dimensional tolerance

• Metallic indium delivers excellent thermal conductivity. Soft and deformable, it perfectly conforms to chips and heat‑dissipation structures with extremely low void rate

• Tolerates high‑low‑temperature cycling, buffers chip thermal warpage, and resists cracking and delamination. Complies with stringent requirements for server, automotive‑grade and military‑grade applications