NCF-103 is a thermally stable rosin-based flux formulated for reflow soldering of solder preforms or solder wires. NCF-103 offers excellent wettability on common metallization surfaces including Cu, Ni, Ag, Pd and Au. It achieves low voids after soldering, and its residues can be easily cleaned.

Performance Features

• Compliant with J-STD-004 ROL0 no-clean requirement 

• Low void rate, low spattering 

• Halogen-free 

• Designed for no-clean application; residues can also be removed with commercially available solvent cleaners

Product Information

Packaging & Storage

25g per syringe, 150g per syringe Store below 25°C. The shelf life is 6 months for unopened packages.