In the post‑Moore era, China’s advanced packaging industry is booming. Processes including 2.5D/3D IC, SiP, Flip‑Chip and TCB thermal compression bonding are being rapidly implemented, driving the substitution of domestic materials. Widely adopted in AI computing chips, wide‑bandgap power devices and chip die‑attach applications, it sets stringent requirements for micro‑joint formation, low void rate, low thermal stress and long‑term reliability.

Driven by 5G/6G technological evolution, the communication, optoelectronic and display industry is trending toward miniaturization and high‑density integration. It mainly covers optical module components, RF units for communication base stations, display modules and high‑speed communication PCBs. Temperature‑sensitive devices demand strong anti‑migration performance to ensure high mass‑production yield and stable long‑term signal transmission.

With rising penetration of new‑energy vehicles, vehicle intelligence fuels surging demand for automotive‑grade electronic components. Applied in BMS, vehicle control units, on‑board chargers, power modules, domain controllers and automotive sensors, products must withstand complex vehicle conditions including wide temperature cycling, mechanical shock, salt spray and humidity to guarantee safe operation of on‑board electronics.

As China’s rail transit network keeps expanding, on‑board electronics operate in harsh environments with extreme temperature swings, constant vibration‑shock, moisture and corrosion. Application scenarios cover on‑board signal control units, traction power modules, train main control boards and vehicle power conversion assemblies. High durability of solder joints is critical to meet long‑term safety service requirements for rail transit equipment.