Wave soldering realizes interconnection between through‑hole component pins and PCB pads by means of molten solder waves. It serves as a core process for mass through‑hole assembly. Pad wettability and solder‑wave stability directly determine the forming quality of through‑hole solder joints and the electrical reliability of complete equipment.

Industry Challenges & Solutions

In mass‑production processes for through‑hole and mixed‑assembly PCBA, process defects such as bridging, icicles, insufficient through‑hole solder filling and partial missed soldering frequently occur. Oxidation inside the solder pot and poor flux compatibility will also raise defect rates.

Huaqing’s lead‑free anti‑oxidation solder bars and dedicated wave‑soldering fluxes stabilize the soldering environment inside the solder pot and enhance overall wettability, well suited for large‑scale high‑efficiency production.