Die Attach is the process of precisely and firmly mounting diced bare dies onto lead frames or metal substrates such as DBC and IMS by means of solders or adhesives. 

This step not only forms the foundation for electrical connection between chips and external circuits, but also acts as a critical factor determining device heat‑dissipation performance and long‑term reliability.

Industry Challenges & Solutions

Faced with new‑generation high‑power and high‑frequency devices such as SiC, conventional solder pastes or silver pastes often fail to simultaneously meet requirements for low void rates, high thermal conductivity and high‑temperature service stability. This may trigger local overheating, shortened service life, and even device failure under extreme operating conditions.

Targeting the stringent Die Attach requirements for power devices, Huaqing Electronic Materials has developed a series of high‑performance sintered silver solders. Boasting ultra‑high thermal conductivity (>180 W/mK) and electrical conductivity, the materials support pressure‑free or low‑pressure sintering at moderate‑low temperatures. The formed solder joints deliver extremely low void rates and outstanding high‑temperature mechanical stability. They fully unlock the high‑performance potential of third‑generation semiconductors including SiC and provide ultimate reliability assurance for customers’ power devices.