Huaqing Confirms Participation in productronica Shanghai 2027

Lead

As an annual bellwether for the Asia‑Pacific electronics manufacturing industry, productronica Shanghai 2027 will grandly open at Shanghai New International Expo Centre (SNIEC) from March 24 to 26, 2027. Shanghai Huaqing Solder Material Technology Co., Ltd. has officially confirmed its participation. It will present a full portfolio of high‑reliability soldering materials covering five application scenarios: precision SMT assembly, power semiconductors, semiconductor packaging, special‑temperature‑low soldering, and through‑hole wave soldering. Targeting automotive electronics, new‑energy energy storage, industrial control, optical communication and 3C precision electronics sectors, Huaqing delivers one‑stop mass‑production soldering solutions and joins industry partners to explore innovative pathways for the localization of high‑end electronic assembly.

I. Industry Mega‑Event Connecting the Global Electronics Manufacturing Chain

Since its debut in China in 2002, productronica Shanghai has grown into China’s largest and most professional exhibition covering the full electronics manufacturing chain. This edition opens eight halls including E1‑E5 and W1‑W3 with 80,000 ㎡ exhibition area. More than 1,450 leading domestic and overseas enterprises will attend, expecting to draw 86,900 professional procurement specialists and R&D engineers from equipment, material and end‑product manufacturing sectors.

The exhibition covers core segments such as SMT surface‑mount technology, electronic chemical soldering materials, power‑device packaging, wire harness processing, intelligent automation, X‑Ray inspection and advanced semiconductor assembly. It focuses on hot‑track sectors including new‑energy vehicles, energy‑storage converters, AI computing hardware, optical modules and industrial servos. Multiple technical forums will be held concurrently, building an integrated platform for technical matching, new‑product launching and business negotiation. It serves as a key gateway for electronic‑material enterprises to showcase in‑house R&D strength and engage high‑volume mass‑production customers.

Driven by surging demands for miniaturization, high‑power performance and high reliability, new processes such as fine‑pitch BGA soldering, thermal soldering for IGBT power modules, assembly of temperature‑sensitive components and formic‑acid vacuum die‑attach have become key industry challenges. High‑end domestic soldering materials are entering a golden phase of import substitution. With 27‑year R&D expertise in electronic soldering materials, Huaqing leverages its in‑house laboratory and mature mass‑production lines to address real‑world manufacturing pain‑points. At the show, Huaqing will display its complete matrix of innovative process‑oriented products.

II. Five Product Series Cover Full‑Scenario Electronic Soldering Requirements

Centered on the theme Full‑Process High‑Reliability Soldering‑Material Solutions, Huaqing will feature five flagship solder‑paste series together with supporting solder preforms, solder bars and fluxes to satisfy diverse PCBA and semiconductor manufacturing scenarios.

Solder Paste for High‑Precision BGA Packaging

Designed for high‑density chip mounting of fine‑pitch BGA, QFP and Flip‑Chip devices. It features highly spherical powder particles and outstanding printing stability, delivering dense and continuous solder joints after reflow. It enables stable low‑void performance and mitigates mass‑production defects including offset, cold solder joints and bridging. Widely adopted for optical‑communication modules, computing mainboards and precision industrial control boards.

Special Soldering Materials for IGBT / MOSFET / IPM Power Devices

Developed for new‑energy electronic control units, energy‑storage power boards and servo drive boards, including power‑device solder paste and low‑void solder preforms. The solder layers offer superior thermal conductivity and thermal‑shock resistance to reduce thermal resistance of power devices, resolving voiding and thermal‑failure risks under high‑current conditions. Suitable for demanding applications such as on‑board‑chargers (OBC), inverters and industrial power modules.

Low‑Temperature Solder Paste Series

Based on tin‑bismuth low‑melting‑point alloy system to significantly lower peak reflow temperature. Optimized for heat‑sensitive substrates including flexible FPC, LED panels, plastic‑encapsulated components and thermal‑sensitive chips. It avoids substrate delamination, component deformation and device burnout to meet assembly requirements for thin‑form precision electronics.

Wave‑Soldering Solder Bars & Matching Fluxes

For mass production of home‑appliance mainboards, power supply through‑hole boards and harness control boards. The alloy delivers strong anti‑oxidation capability and stable solder wave surface, reducing defects such as dross, solder balls, pinholes and bridging. It supports long‑term automated continuous production and effectively lowers rework costs.

Formic‑Acid‑Reflow Die‑Attach Solder Paste

Engineered for vacuum die‑attach processes for semiconductor SiP and power devices. It leaves minimal oxidative residues and delivers robust interfacial bonding with ultra‑low void rate. Suitable for automotive power packaging and optical‑component TOSA/ROSA packaging, advancing localization of high‑end semiconductor‑packaging materials.

Besides flagship solder pastes, supporting products including solder preforms, no‑clean fluxes and solder wires will be on display. On‑site process engineers provide one‑on‑one process diagnosis and customized material solutions for real‑world manufacturing challenges such as voiding, open solder joints, thermal damage and printing defects.

III. Advancing Domestic‑Material Innovation for High‑Quality Smart Manufacturing

Founded in 1999, Shanghai Huaqing Solder Material Technology Co., Ltd. evolved from Shanghai Huahai Solder‑Material Technology Research Institute. Specializing in R&D and manufacturing of high‑end electronic soldering materials, the company holds multiple invention patents. Its product portfolio spans semiconductor packaging, automotive electronics, industrial control, medical electronics, photovoltaic energy storage and more. It supplies stable volumes to hundreds of leading domestic manufacturers and steadily pushes forward import substitution for high‑end packaging soldering materials.

Guided by the R&D mission “solve real‑world mass‑production soldering challenges”, Huaqing keeps iterating low‑void, high‑temperature‑resistant, low‑temperature eco‑friendly and no‑clean soldering products responding to industry trends toward miniaturization, higher power density and enhanced reliability. It balances yield improvement and production‑cost optimization. Participation in productronica Shanghai represents a full demonstration of Huaqing’s product portfolio. The company looks forward to in‑depth exchanges with upstream and downstream partners to explore collaborative opportunities.

Invitation

March 24‑26, 2027 | Shanghai New International Expo Centre (SNIEC). Huaqing warmly welcomes industry peers, procurement managers and SMT process engineers to visit our booth. On‑site sample collection and custom soldering‑material solution discussions are available. Let us shape the innovative future of domestic electronic materials together!