Formic‑acid Flux
Formic‑acid flux is mainly used for high‑end semiconductor precision packaging soldering scenarios, including IGBT and SiC power modules, optical‑communication devices, automotive precision electronics and MEMS sensors.
Overview
Formic‑acid flux is a residue‑free vapor‑phase reduction flux system. It relies on formic‑acid vapor to reduce oxide layers on solders and pads at elevated temperatures. Conventional liquid flux is not required. All reaction by‑products are gaseous and can be fully vented out without leaving impurities to contaminate solder joints.
Applicable Processes
Compatible with high‑end packaging processes such as vacuum formic‑acid reflow soldering, precision nitrogen‑atmosphere reflow soldering and vacuum thermo‑compression bonding for power devices. It works with various solid soldering materials including pre‑formed solder foils, rectangular solder pellets and solder rings.
Core Advantages
Zero Residue & Contamination‑free
Eliminates risks of electric leakage, corrosion and optical‑path obstruction caused by residues from conventional fluxes.
Powerful Reduction Capacity
Thoroughly removes micro‑scale oxide layers to deliver excellent joint wettability and ultra‑low void rate.
Simplified Process Flow
Meets high‑cleanliness requirements with no post‑soldering cleaning steps needed, streamlining overall manufacturing workflows.
High Thermal Stability
Resists carbonization under high temperature, fully satisfying high‑reliability and long‑life packaging standards for automotive‑grade, optical‑communication and semiconductor applications.
Quickly browse products and applications. VisitProduct Centerfor matching inquiries.
Related Products
Related Applications
Market
Follow Us 