Features ultra‑low void performance, specially optimized for designs with large ground pads also known as Bottom Termination Components (BTCs). BTCs cover packages such as QFNs, DPAKs and MOSFETs.

The flux chemistry of LF‑218P is carefully engineered to enhance reliability by minimizing voiding, maximizing ECM resistance and mitigating Head‑in‑Pillow defects. It also provides excellent wettability and complies with IPC specifications. LF‑218P is compatible with lead‑free alloys including SnAgCu, SnAg and other widely‑adopted alloy systems within the electronics industry.

Product Features

• Ultra‑low void performance for Bottom Termination Component (BTC) assemblies

• Enhanced electrical system reliability

• Excellent resistance to solder‑bead formation; minimal bridging, slumping and Head‑in‑Pillow defects

• Good wettability on fresh and aged common metals and surface‑finish substrates, including but not limited to OSP, Immersion‑Sn, Immersion‑Ag and ENIG

• Superior printing performance — high transfer efficiency and low variability