WSF-F01 flux is a high-reliability, halogen-free water-soluble flux, engineered to deliver simple and efficient solutions for complex process scenarios. Featuring a high-performance activator system, it effectively enhances wettability on metal finishes of demanding substrates, including Cu OSP, ENEPIG and ENIG. With outstanding oxide removal capability, it achieves excellent soldering results on reflow-oxidized pads even without pre-cleaning treatment.

WSF-F01 possesses favorable rheological properties and is formulated specifically for the following processes: dip fluxing for Flip-Chip, pin transfer or printing for BGA Ball-Attach (compatible with ball diameters of 0.25 mm and above). WSF-F01 also exhibits remarkable performance in suppressing solder ball shifting. It minimizes bridging and non-wetting defects for fine-pitch solder balls, reduces missing-ball risks (especially for BGA/CSP packages), and inhibits electrochemical migration (ECM), thereby improving production yield.

Performance Features

• Designed for FC and BGA BM pin transfer / printing applications 

• Excellent wettability on a wide range of substrate surfaces

 • Minimizes bridging, non-wetting and missing balls 

• Superior oxide removal; no pre-cleaning required for oxidized pads 

• Stable dynamic viscosity to ensure consistent flux pickup

 • Bright, full solder joints with low voids 

• Halogen-free 

• Good washability with no flux residues left after cleaning

Product Information

Packaging & Storage

Available in 25 g / syringe and 150 g / syringe. Other packaging specifications can be provided upon request.

Shelf life is 12 months when stored below 30°C and protected from light. Refrigerated storage can further extend shelf life. If refrigerated, sufficient warm-up time (typically 2–4 hours) is required before use.