WSF-F04 effectively reduces or eliminates voids. It maintains outstanding void suppression capability even in void-prone scenarios such as damaged solder bumps, oxidized solder bump surfaces, or poor pad plating finishes. 

WSF-F04 features a distinctive red color engineered for machine vision and visual inspection to avoid misjudgment.

Performance Features

• Designed for flip-chip dip processes 

• Excellent wettability and oxide removal capability 

• Halogen-free 

• Superior washability; cleanable with room-temperature deionized water 

• Compatible with both tin-lead and lead-free soldering 

• Good application stability 

• Special color formulation to prevent visual misjudgment

Product Information

Packaging & Storage

Available in 25 g/syringe and 150 g/syringe. Other packaging specifications are available upon request.

The shelf life is 6 months when stored below 27°C and protected from light. Refrigerated storage can further extend shelf life. If refrigerated, sufficient warm-up time (typically 2–4 hours) is required before use.