NCF-U01 features a unique flux system that enables soldering at temperatures ranging from 250°C to 400°C. It delivers excellent soldering performance on BGA solder balls and copper pillars, leaving minimal residues after bonding. NCF-U01 provides superior wettability with rapid tinning and stable performance. The solder joints are bright and flat, and it achieves outstanding void performance.

NCF-U01 has highly stable rheological properties. Consistent coating weight can be guaranteed with ball transfer, pin transfer or printing processes, supporting stable high production yields.

Performance Features

• Excellent wettability and low void rate 

• Good wetting on silver, copper, nickel and gold interfaces 

• Compatible with medium and high-temperature alloys including SAC, SnSb, PbSnAg and Au80Sn20 

• Minimal residues

• Excellent continuous run performance 

• Halogen-free 

• Minimal spattering; no chip discoloration 

• Suitable for nitrogen reflow

Product Information

Packaging & Storage

Available in 10 g/syringe, 25 g/syringe and 150 g/syringe.

Shelf life is 6 months when stored below 30°C and protected from light. Refrigerated storage can further extend shelf life. If refrigerated, sufficient warm-up time (typically 2–4 hours) is required before use.