NCF-U11A flux is an ultra-low residue no-clean flux designed for Ball Mount, Flip Chip and Thermal Compression Bonding (TCB) processes. Formulated without any halogen, it delivers excellent wettability and soldering activity to guarantee interfacial bonding strength and soldering reliability.

NCF-U11A leaves ultra-low residues (<5%) and is non-corrosive. Moreover, these trace residues are fully compatible with underfill materials and will not induce defects such as delamination during reliability tests.

NCF-U11A features high tackiness to suppress solder ball shifting during reflow and improve yields for fine-pitch ball mounting. Its favorable rheological properties ensure consistent flux coating weight.

Performance Features

• Excellent wettability on common metal interfaces 

• Low void rate, critical for high-reliability applications 

• High tackiness for high production yield 

• Zero halogen addition 

• Mild chemistry with minimal residues 

• Good long-term storage stability 

• Compatible with various solder alloys (SnAgCu, SnPb, SnAg, etc.)

Product Information

Packaging & Storage

Available in 10 g/syringe, 25 g/syringe and 150 g/syringe.

Shelf life is 6 months when stored below 30°C and protected from light. Refrigerated storage can further extend shelf life. If refrigerated, sufficient warm-up time (typically 2–4 hours) is required before use.