Applications of Solder Preform Pellets

• Increase solder volume: For SMT assembly, solder preforms can be placed onto solder-paste printed pads to flexibly and accurately add solder volume where extra solder is required on selected pads.

• Reduce residues: Flux typically accounts for 10–15 wt% of solder paste, and resin and other components leave residues on pads after soldering. Using solder preforms together with solder paste significantly cuts the flux weight fraction, thus minimizing post-solder residues.

• Reduce voids: Void formation is strongly correlated with the flux proportion in solder paste. Solder preforms raise the metal content of the solder system and help lower void rates.

• Soldering for hard-to-access areas: For locations where solder paste cannot be easily applied, flux-coated solder preforms offer a flexible process solution.

Performance Features

• Low impurity content 

• Uniform composition, no segregation 

• Low oxygen content, excellent wettability 

• Clean surface, free of contamination, oil stains and fingerprints

Dimensional Tolerance

Packaging Options

Reel size: 7 inch / 13 inch

Common Alloys

Storage

To prevent surface oxidation, carrier tape packaged products shall be stored in a dry indoor environment. For bottle-packed products, store in a nitrogen cabinet after opening. Recommended shelf life: 12 months from the production date.