WSF-B20 is a water-soluble flux for flip-chip ball mounting and BGA ball placement. WSF-B20 is halogen-free and passes the copper mirror test. It delivers excellent soldering wettability and ultra-low voids in solder joints.

Performance Features

• Formulated for pin transfer and stencil printing 

• Outstanding solder wettability, void-free performance 

• Residues can be easily removed by aqueous cleaning systems

• Compatible with various solder alloys including SnAgCu, SnSb, etc. 

• Nitrogen reflow atmosphere is recommended 

• Halogen-free

Product Information

Packaging & Storage

25g per syringe, 150g per syringe. Other packaging specifications are available upon request.

Shelf life is 6 months when stored below 27°C away from light. Low-temperature storage can further extend shelf life. If refrigerated, allow sufficient warm-up time (typically 2–4 hours) before use.