Formex 501 is a binder designed for formic acid reflow environments. Typically used together with solder preforms, it prevents shifting of chips and solder preforms. Its specially formulated system delivers good interfacial adhesion, without interfering with formic acid’s reduction of oxides on solder and base metal surfaces.

Formex 501 is halogen-free. It fully vaporizes during reflow, causing no corrosion to components or equipment, and has no adverse impact on subsequent wire bonding, underfill or molding processes.

Performance Features

• Residue-free after reflow

• Low voids, no spattering

• Good tackiness and interfacial adhesion

• Compatible with molding and potting compounds

• Compatible with the same reflow profile used for solder preforms

• Suitable for SnAgCu, SnSb and PbSnAg alloys

Product Information

Packaging & Storage

10g per syringe, 25g per syringe

Store at room temperature. Use within 6 months from the production date.