NCP614 no-clean solder paste is designed for high-precision SMT and intermetallic soldering. It is formulated with high-temperature resistant special flux and low-oxidation tin-lead alloy powder. It delivers outstanding soldering performance with bright and full solder joints, and performs well on fine-pitch components including QFN, QFP, SOIC, TSSOP and BGA.

Compared with other products, NCP614 achieves higher assembly yield with minimal defects such as solder balling, bridging and tombstoning. It maintains stable printing and soldering performance during prolonged use or under harsh working conditions.

NCP614 features a wide process window and is compatible with various reflow profiles. Consistent solder joints can be obtained even in reflow ovens with low thermal capacity.

Performance Features

• Compliant with IPC J-STD-004 ROL0 no-clean requirements

• Minimal soldering defects: solder balling, bridging, tombstoning

• Wide reflow window, compatible with multiple reflow profiles

• Good flowability and viscosity stability

• Excellent wettability for hard-to-solder metals such as Ni and Pd

• Full and bright solder joints, probe-testable after soldering

• Colorless, transparent, non-corrosive residues; no cleaning required

• Suitable for reflow under air or nitrogen atmosphere

Product Information

Packaging & Storage

500g per jar, 10kg per carton

6 months shelf life when stored at 2–10°C; 3 months shelf life when stored in cool and dry environment below 25°C.